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PCB Handling Equipment with Laser Positioning and MCGS Touch Screen Control

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PCB Handling Equipment with Laser Positioning and MCGS Touch Screen Control

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Brand Name : HSTECH

Model Number : HS-620

Certification : CE

Place of Origin : China

MOQ : 1 set

Price : Negotiable

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 100 sets per month

Delivery Time : 7~9 work days

Packaging Details : Wooden package

Product Name : BGA Rework Station

Warranty : 1 Year

Control : Touch screen

PLC : MITSUBISHI

Relay Brand : Schneider

Optoelectronic Switch : OMRON

Material : Aluminum Alloy

Condition : New

Thickness : 0.3 - 5mm

Signal : SMEMA

Application : Electronic Assembly

Color : Silver

Control System : PLC

OEM/ODM : Available

Total power : 2600W

Power Supply : AC220V

Air Pressure : 4-6bar

Mounting accuracy : ±0.01mm

Type : Automatic

Weight : 30KG

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Manual & Automatic Laser Position MCGS Touch Screen Control BGA Rework Station

​Specification

BGA Rework Station Model:HS-620
Power Supply AC 220V±10% 50/60Hz
Total power 3500W
Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
Electric material Driving motor+PLC smart temp.controller+color touch screen
Temperature control independent temp.controller,the precision can reach ±1℃
Temperature Interface 1pcs
Locating way V shape slot,PCB support jigs can adjust,laser light do fast centering and position
Overall dimension L650mm*W630mm*H850mm
PCB size Max 450mm*390mm Min 10mm*10mm
BGA size Max 80mm*80mm Min 1mm*1mm
Weight of machine 60KG
Usage Repair chips / phone motherboard etc

Features

1.Automatic&Manual operation system.

2. 5 million CCD camera optical alignment system mount precision:±0.01mm.

3.MCGS touch screen control.

4.Laser position.

5.Repair success rate 99.99%.

Advantages

Upper and lower heaters

1.integrated design of hot air heating head and mounting head.
2.lt has three independent heating zoneswith fast heating and a large temperature differencebetween the repair platform and the nearby. BGAwhich does not affect the surrounding BGA during heating.

Bottom heater

1.Use ceramic heating plate.
2. Make the heating of the PCB board more unifo.

Infrared heating area control switch

Control the left and right heatingplates to minimize poweroutput and save energy

About Packaging

PCB Handling Equipment with Laser Positioning and MCGS Touch Screen Control

PCB Handling Equipment with Laser Positioning and MCGS Touch Screen Control

PCB Handling Equipment with Laser Positioning and MCGS Touch Screen Control


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